DICING SAW - DISCO DAD3220


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GENERAL INFORMATION

Wafer dicing is the process by which dies are cut out from the wafer using a special blade following the processing of the wafer. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted.

For more information please contact the clean room staff at cnicleanroom@columbia.edu.