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SHARED MATERIALS CHARACTERIZATION LABORATORY (SMCL)
CUNY ADVANCED SCIENCE RESEARCH CENTER
DEPOSITION AND GROWTH
- EDWARDS BOC/AUTO 306 THERMAL EVAPORATOR (THERMAL DEPOSITION)
- CRESSINGTON 108 MANUAL SPUTTER COATER (SAMPLE COATING FOR SEM)
- OXFORD PLASMAPRO NPG80 PECVD (DEPOSITION OF SiO2, SiNx AND AMORPHOUS Si FILMS)
- ANGSTROM EVOVAC DEPOSITION SYSTEM (E-BEAM, THERMAL AND SPUTTER DEPOSITION)
- ANGSTROM ULTRA HIGH VACUUM E-BEAM DEPOSITION SYSTEM
- AJA DIELECTRIC SPUTTERING ORION-8
- AJA METALLIC SPUTTERING ORION-3
- CAMBRIDGE NANO TECH INC SAVANNAH 200 (ATOMIC LAYER DEPOSITION SYSTEM)
- PARYLENE COATER (CHEMICAL VAPOR DEPOSITION)
- EXPERTECH LPCVD FURNACE (SiNx, SiOx, SiC, AND ANNEAL)
DRY ETCH AND WET PROCESSING
- OXFORD PLASMA PRO 100 COBRA - CL RIE
- OXFORD PLASMA PRO 100 COBRA - F RIE and DRIE
- OXFORD PLASMALAB 80+ ICP (ICP ANISOTROPIC ETHCING OF Si, SiO2, SiN AND DIELECTRIC MATERIALS)
- DIENER PLASMA ETCH SYSTEM (OXYGEN AND HYDROGEN PLASMA ETCH SYSTEM)
- ANATECH PLASMA ASHER
- REYNOLDSTECH WET PROCESSING STATIONS
- RCA STATION
- SRD WAFER CLEANING
PHOTOLITHOGRAPHY
- BAL-TEC CRITICAL POINT DRYER 030 (CRITICAL POINT DRYER)
- SUSS MICROTEC MA6 (MASK ALIGNER)
- SUSS MICROTEC DUV MA6 (MASK ALIGNER)
- NANONEX IMPRINTER (NANO PRINT LITHOGRAPHY)
- HEIDELBERG µPG 101 LASER WRITER 3 MICRON (LASER WRITER)
- HEIDELBERG DWL 66+ LASER WRITER
- LAUREL SPIN COATER
- REYNOLDSTECH PHOTOLITHOGRAPHY HOODS AND SPINNERS, HOT PLATES