TECHNICS SERIES 800 RIE


OPERATING INSTRUCTIONS 

GENERAL INFORMATION

The Technics Series 800 RIE (Oxygen Plasma Asher) uses an oxygen plasma to remove organic materials, such as photoresist, from substrate surfaces. Common uses include descumming of resist from exposed surfaces before etching or metallization, or the cleaning of substrates to remove stubborn resist deposits. An oxygen plasma is used to isotropically remove organic material, like photoresist. Placing a substrate or wafer in an oxygen plasma for short periods of time will remove any unwanted thin layers of photoresist and clean up pattern edges. In essence, the plasma ashing or burning of the photoresist removes it. This material residue is normally referred to as scum.

CONTACT INFORMATION
For additional information about the Technics Series 800 RIE, please contact James Vichiconti at jv2534@columbia.edu.