ANGSTROM EVOVAC DEPOSITION SYSTEM


OPERATING INSTRUCTIONSMORE INFO

GENERAL INFORMATION

Angstrom Engineering’s EvoVac Multi-Process thin film deposition system allows sample coating using a variety of deposition techniques within the same machine.

Some available materials include: 

  • E-Beam (Au, Pd, AuPd, Pt, Ti, Ag, Cr)
  • Thermal (Al, Cr)
  • Sputter (Ni, W, Al, Cu, Ti, InSnO2)

The capabilities of the system are found below.

THERMAL RESISTIVE EVAPORATION
Two resistively heated evaporation sources can deposit simultaneously or along with the electron beam source. Various boat, filament and crucible heated sources can be fitted to the source clamps to meet your process needs.

ELECTRON BEAM EVAPORATION
A 6 pocket ebeam source with 12cc crucibles provides the capability to evaporate high melting point materials including refractory metals and ceramics. The programmable 2-axis sweep controller allows the user to control the beam pattern for optimal melt control.

SPUTTER DEPOSITION
Two 3in circular sputter sources sharing a 600W RF power supply allows the deposition of metal and ceramic materials. An automatic pressure and flow control system allows the user to precisely blend up to 3 different gases which is useful when depositing compound materials.

DEPOSITION CONTROL
Deposition processes are recipe driven and are software controlled using feedback from quartz rate monitors. Shutters are automatically actuated and sources are thermally conditioned based on recipe inputs which allows for a repeatable process.

SUBSTRATE CAPABILITY
6.0in x 6.0in or smaller substrate pieces can be mounted in the system and can be temperature controlled from ambient to 400ºC. A plasma glow discharge source provides precleaning of the substrate surface insitu immediately prior to material deposition.

LOAD LOCK
Substrates and masks can be loaded into the a storage rack located within the load lock or they can be loaded directly into the deposition chamber. This allows masks can be exchanged for different material layers without venting the chamber.

CONTACT INFORMATION
For additional information about the Angstrom EvoVac Deposition System, please contact James Vichiconti at jv2534@columbia.edu or email the clean room staff at cnicleanroom@columbia.edu.