OXFORD PLASMALAB 80 PLUS ICP 65


OPERATING INSTRUCTIONS | MORE INFO

GENERAL INFORMATION

Inductively Coupled Plasma (ICP) etching is a technique which uses a radio frequency (RF) energy coupled into a low pressure gas by an inductive coil mounted on the outside of a quartz window. This technique allows fabrication of high aspect ratio silicon features with vertical sidewalls; based on the inductive generation of a plasma containing free fluorine (F), which etches silicon. Two independent power supplies are used in this system. A low frequency supply is used to generate a high density plasma above the surface of the substrate. A high frequency supply provides a substrate bias to extract ions from the plasma. This combination allows high density plasmas to process substrates at low substrate bias which yields very high throughput and low damage to the substrate.

Instrument/process parameters such as gas flow rates, chamber pressure, coil power and the geometries of the pattern being etched affect process results. ICP etchers produce relatively low ion energies; so biasing of the substrate being etched is used to tailor ion bombardment energies and tune the degree of anisotropy of the etch features. This machine is totally computer controlled. Process recipes can be written while system is in the operate mode. Recipes can be run automatically. Typical materials etched by this process include: SiN, SiO2, Si, and metal masked materials.

CONTACT INFORMATION
For additional information about the Oxford PlasmaLab 80 Plus ICP 65, please contact James Vichiconti at jv2534@columbia.edu or email the clean room staff at cnicleanroom@columbia.edu.