TPT WIRE BONDER HB10


 
 

GENERAL INFORMATION

This new semi-auto wire bonder is capable of Ball (15-50um), Wedge (17-75um), Bump, and Ribbon (max 25x250um) Bonding. It has the options of Au, Al, Cu, and Ag wires. The Z-axis is motorized. X-Y are manual.

CONTACT INFORMATION
For additional information about the cleanroom bonders please contact the clean room staff at: cniCR@columbia.edu.

 Manual can be found here.

 Video for the tool operation, can be found:

TPT Install Wire1, 2, 3

Capillary Tool Instal1, 2

Wedge Tool Install

Training - Height Setup & 1st Bond

Training - Control Screen & Software