TPT WIRE BONDER HB10
+ SHARED LABS HOME
+ EXTERNAL USER PROGRAM
+ CNI LABS NEWSLETTER
+ BADGER
+ CLEAN ROOM
- CLEAN ROOM HOME
- CLEAN ROOM ACCESS PROTOCOL
- EQUIPMENT TRAINING
- PROCESS & FABRICATION
- EQUIPMENT LIST
- EQUIPMENT RATES & SUPERUSERS
- EQUIPMENT STATUS
- SAFETY
- RELATED LINKS
+ ELECTRON MICROSCOPY
- EM LAB HOME
- SERVICE REQUEST FORM
- EM LAB ACCESS
- TRAINING & CERTIFICATION
- EQUIPMENT LIST & RATES
- FEI TALOS S-TEM
- ZEISS SIGMA VP SEM
- EM IMAGE GALLERY
+ SHARED MATERIAL CHARACTERIZATION LAB
GENERAL INFORMATION
This new semi-auto wire bonder is capable of Ball (15-50um), Wedge (17-75um), Bump, and Ribbon (max 25x250um) Bonding. It has the options of Au, Al, Cu, and Ag wires. The Z-axis is motorized. X-Y are manual.
CONTACT INFORMATION
For additional information about the cleanroom bonders please contact the clean room staff at: cniCR@columbia.edu.
Manual can be found here.
Video for the tool operation, can be found: