ANGSTROM UHV E-BEAM DEPOSITION SYSTEM


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OPERATING INSTRUCTIONSMORE INFO

GENERAL INFORMATION

Angstrom Engineering’s Ultra High Vacuum Nexdep Based e-beam deposition system allows high quality thin films deposition. The system is mostly dedicated for precious metals and high quality contacts formation.

Some available materials include: 

  • Au, Pd, AuPd, Pt, Ti, Cr, Co,

Other metals are available in the other Angstrom evaporator and the Edwards thermal evaporation.

SYSTEM INFORMATION
The system includes a load lock with turbo pumping and a vacuum chamber (16"x16"x28") designed for ultra high vacuum (ConFlat flange and copper gaskets), connected to a cryogenic pump with expected pressure <9E10-9Torr. The system consists of a Telemark 269 UHV series, 6x15cc multi pocket electron beam source package, and insitu crystal thickness monitoring. The stage (100mm in size) is rotated during deposition to ensure high degree of deposition uniformity and the substrate can be heated using an IR quartz lamp up to 600C. The evaporator has two separate shutters for the crucible and for the substrate.

CONTACT INFORMATION
Users who have access to the clean room can start shadowing a group member for training on the evaporator. For certification on the evaporator (after training) please sign up here.
For additional information about the Angstrom UHV E-beam Deposition System, please contact Dr. Jen Yu at jy2488@columbia.edu or email the clean room staff at cnicleanroom@columbia.edu.