MORE INFO | OPERATING INSTRUCTIONS

Standard Operating Procedure

GENERAL INFORMATION
Wafer dicing is the process by which dies are cut out from the wafer using a special blade following the processing of the wafer. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted. The Disco DAD 3220 is a single spindle dicing saw which can take up to 6” of substrates. Standard blades are suitable for cutting silicon. Other blades are also available upon request.

For more information please contact the clean room staff at: cniCR@columbia.edu.