DICING SAW - DISCO DAD3220
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Wafer dicing is the process by which dies are cut out from the wafer using a special blade following the processing of the wafer. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted. The Disco DAD 3220 is a single spindle dicing saw which can take up to 6” of substrates. Standard blades are suitable for cutting silicon. Other blades are also available upon request.
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