DICING SAW - DISCO DAD3220


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GENERAL INFORMATION

Wafer dicing is the process by which die are separated from a wafer following the processing of the wafer. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted. The dicing saw is now available to use in the new clean room.

For more information please contact the clean room staff at cnicleanroom@columbia.edu.