EDWARDS BOC/AUTO 306 THERMAL EVAPORATOR


GENERAL INFORMATION | OPERATING INSTRUCTIONS
The Edwards/BOC Thermal Evaporator is currently going through an interface upgrade and automation. This evaporator is used for the deposition of most metals including: Au, Ti, Cu, Al, Pt, Cr, Au/Ge, Au/Be and Ni. The evaporator vacuum is obtained using a direct drive mechanical pump and turbomolecular pump; ultimate vacuums attained are in the mid 10-7 torr range. The deposition rate is monitored by a calibrated frequency thickness monitor; the power supply to apply current for evaporation is manually controlled. Resistive thermal evaporation is the most commonly used metal deposition technique. It consists of vaporizing a solid material (pure metal) by heating it to sufficiently high temperatures and recondensing the material onto a cooler substrate to form a thin film. The heating is carried out by passing a large current through a filament container (tungsten boat or material coated tungsten rod), which has a finite electrical resistance.

CONTACT INFORMATION
For additional information about the Edwards/BOC Thermal Evaporator, please contact James Vichiconti at jv2534@columbia.edu or email cnicleanroom@columbia.edu.