CHEMICAL MECHANICAL POLISHING G&P POLI-400L


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GENERAL INFORMATION

Chemical Mechanical Polishing is the process of planarizing thin films using gentle removal of material by both physical and chemical means. The CMP is located at the back end inside the clean room. Polishing of 4" wafers (both standard thickness and 400um thick) and some pieces is possible. Celexis and Klebosol slurries for STI and ILD applications, respectively, are available.

For more information please contact the clean room staff at cnicleanroom@columbia.edu.