SÜSS MA6 MASK ALIGNER
STANDARD OPERATING PROCEDURE | MORE INFO
The MA6 is designed for all standard lithography applications. For thick resist MEMS applications the MA6 offers high quality exposure optics for high resolution and optimum edge quality.
The UV exposure optics of the MA6 can be used for full field exposure of wafers up to 6" in size but can also process pieces. The MA6 handles both proximity and (soft, hard, vacuum) contact printing, allowing for a resolution of 2.5 μm in proximity mode and sub-micron in vacuum contact mode.
TOP SIDE ALIGNMENT
The MA6 is equipped with a motorized Topside Alignment System providing a high precision alignment accuracy of ± 0.5 μm.
For additional information about the SÜSS MicroTec MA6 Mask Aligner, please contact Dr. Jen Yu at firstname.lastname@example.org or email the clean room staff at email@example.com.