CNI SHARED FACILITIES NEWS
CLEAN ROOM ACCESS PROTOCOL
TRAINING AND CERTIFICATION
PROCESS AND FABRICATION
EQUIPMENT RATES and SUPERUSERS
The cleanroom is now open for all processes except TGMS related equipment. Please sign up for the CNI shared facilities newsletter in order to receive updates and important announcements here.
The CNI Clean Room in the Morris A. Schapiro Center for Engineering and Physical Science Research (CEPSR) is dedicated to providing the instrumentation, technical expertise, and team-teaching environment to stimulate collaborative research in nanoscale technology. The facility supports the creation and evaluation of devices and materials with state of the art fabrication equipment.
The Clean Room is a multidisciplinary laboratory that supports research across many different departments within Columbia University as well as researchers from other academic institutes and industrial users. The laboratory supports not only materials and device research in physics, electrical engineering, applied physics, mechanical engineering and chemistry, but it also facilitates research interaction and collaboration between the physical, chemical, biological and medical disciplines and is open to all. The facility represents a strategic capability for the Nanoscale Science and Technology research on the Columbia Campus.
The recently opened renovated and expanded CNI Clean Room occupies approximately 5,000 square feet of space. It is divided into 7 separate bays, each dedicated to a set of related fabrication processes:
- Optical lithography bay consisting of dedicated fume hoods and spinners for photoresist coating, two mask aligners (one for DUV applications), two mask fabrication systems: a manual Laser Writing and Mask Fabrication system (3µm resolution) and an automatic Laser Writer system with submicron resolution, and two plasma ashers with oxygen and forming gas plasma for resist stripping and descum.
- Wet chemical bay with an automatic RCA bench, SRD for 4" wafers, general acid hood and general base hood for various wet etch clean and patterning processes.
- Plasma bay with Reactive Ion Etching (RIE) plasma processing based on chlorine and fluorine chemistries, as well as Deep RIE for high aspect ratio and selectivity etching, and PECVD for silicon oxide and silicon nitride deposition.
- Deposition bay including two sputtering systems (dedicated to metals and dielectrics respectively), an e-beam evaporator, UHV e-beam evaporator, Atomic Layer Deposition, and a thermal evaporator (the three latter are located in the Plasma bay due to space considerations).
- Microscopy bay consisting of high resolution SEM with e-beam writing capabilities, as well as optical profiler and filmetrics thin film measurements.
- Furnace bay with 4 LPCVD tubes for silicon oxide, silicon nitride, silicon carbide, and thermal anneal capabilities.
- Backend bay consisting of a Dicing saw, Chemical Mechanical Polishing (CMP) system for planarization of thin films, Wire bonders (Al and Au), and a Critical Point Dryer.
Lithographic capabilities include nano-scale features down to less than 50 nanometers using a Nanobeam nB4 E-beam writing system which is located in the North West Corner building.
*Gallery pictures credit: Timothy Lee